Epoxy
underfill
chip
level
adhesives
Huizhou City, CN
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
통합 및 도구
통합 및 도구