Guangdong, CN
Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress.
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Productos
Integraciones y herramientas
Clientes
Recursos
Términos y políticas
LottieFiles es propiedad de Design Barn Inc.
Copyright © 2024 Design Barn Inc. Todos los derechos reservados.
Hecho con ❤️ desdeVietnam