BGA
Package
Underfill
Epoxy
Guangdong, CN
Electronic products of aerospace and navigation, motor vehicles, automobiles, outdoor LED lighting, solar energy and military enterprises with high reliability requirements, solder ball array devices (BGA/CSP/WLP/POP) and special devices on circuit boards are all facing microelectronics. The trend of miniaturization, and thin PCBs with a thickness of less than 1.0mm or flexible high-density assembly substrates, solder joints between devices and substrates become fragile under mechanical and thermal stress.
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Products
Integrations & Tools
Resources
Terms and Policies
LottieFiles is by Design Barn Inc.
Copyright © 2024 Design Barn Inc. All rights reserved.
Made with ❤️ fromVietnam