Huizhou City, CN
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
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LottieFiles is by Design Barn Inc.
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Products
Integrations & Tools
Resources
Terms and Policies
LottieFiles is by Design Barn Inc.
Copyright © 2024 Design Barn Inc. All rights reserved.
Made with ❤️ fromVietnam